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Embedded System

IEI, the leading embedded system provider, continues to extend the product footprint from component level to system integration service. Our strong knowledge of market and technology innovation offers reliability, flexibility and interoperability for all of our embedded products with choices of size, performance and features.
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AI-powered Box PC

FLEX Series

The FLEX-BX200 is an AI hardware ready system ideal for deep learning inference computing to help you get faster, deeper insights into your customers and your business. IEI’s FLEX-BX200 supports graphics cards, Intel FPGA acceleration cards, and Intel VPU acceleration cards, and provides additional computational power plus end-to-end solution to run your tasks more efficiently. With the NVIDIA TensorRT, QNAP QuAI, and Intel OpenVINO AI development toolkit, it can help you deploy your solutions faster than ever.
CPU
I/O
Expansion

FLEX-BX210-Q470

2U Modular PC with 10/11 th Generation LGA1200 Intel® Core™ i7/i5/i3, Pentium® Processor
10/11 th Gen Intel® Core™ CPU 35/65W
Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
10/11 th Gen Intel® Core™ CPU 35/65W
Intel® Core™ i3-10320 3.8 GHz (up to 4.6 GHz, quad-core, 65W TDP)
Intel® Core™ i5-10500TE 2.3 GHz (up to 3.7 GHz, 6-core, 35W TDP)
Intel® Core™ i7-10700TE 2.0 GHz (up to 4.4 GHz, 8-core, 35W TDP)
M.2:
1 x M.2 B-Key 3042/52 socket
(with SIM card slot, supporting 5G/LTE; supports PCIe 3.0 x1 & USB 3.2 Gen 1)
1 x M.2 M-Key 2280 socket (supports PCle 3.0 x4)
1 x M.2 A-Key 2230 (supports PCIe 3.0 x1 & USB 2.0)
Expansion Slots:
2 x PCle 3.0 x8
2 x PCle 3.0 x4
M.2:
1 x M.2 B-Key 3042/52 socket
(with SIM card slot, supporting 5G/LTE; supports PCIe 3.0 x1 & USB 3.2 Gen 1)
1 x M.2 M-Key 2280 socket (supports PCle 3.0 x4)
1 x M.2 A-Key 2230 (supports PCIe 3.0 x1 & USB 2.0)
Expansion Slots:
2 x PCle 3.0 x8
2 x PCle 3.0 x4
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FLEX-BX200-C246

Intel® Coffee Lake AI Modular Embedded System
Intel® Xeon® E-2176G 3.70 GHz
Intel® Xeon® E-2176G 3.70 GHz
2 x PCIe 3.0 by 8 (by 16 插槽)
2 x PCIe 3.0 by 4
2 x PCIe 3.0 by 8 (by 16 插槽)
2 x PCIe 3.0 by 4
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FLEX-BX200-Q370

Intel® Coffee Lake AI Modular Box PC
8th/9th Genertion Intel CoreTM i7/i5/i3 porcessors in the LGA 1151
8th/9th Genertion Intel CoreTM i7/i5/i3 porcessors in the LGA 1151
2 x PCIe 3.0 by 8 (by 16 slot)
2 x PCIe 3.0 by 4 ( maximum card size supported: 68 mm x 167 mm)
2 x PCIe 3.0 by 8 (by 16 slot)
2 x PCIe 3.0 by 4 ( maximum card size supported: 68 mm x 167 mm)
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