IEI Announced New 3.5'' SBC Featuring 11th Gen Intel® Core™ Processors for Industrial IoT -WAFER-TGL
Aug 24, 2022
Overview
iEi WAFER-TGL takes all the essential elements of the latest 11th Gen. Intel® Core™ U-series processors and combines them with smart manufacturing features and proven durability in the compact size 3.5" form factor.
It is ideal for space-constraints installation, notably AGVs(Automated Guided Vehicle), AMR (Autonomous Mobile Robot) and small cabinets in factories. It features complete I/O interfaces such as three 2.5 GbE LAN ports for motion control / IP cameras, an M.2 B-key with SIM slot for LTE cellular communication, and USB 3.2 Gen 2, serial ports for connecting sensors and communicating with other devices.
CPU Performance
11th Gen. Intel® Core™ U-series
iEi WAFER-TGL is a 3.5" embedded board equipped with the 11th generation Intel® Core™ U processor supporting up to 4 cores, 8 threads, turbo up-to 4.40 GHz. The Intel® Core™ i7 and i5 processors are integrated with Intel® Iris® Xe 96EU graphics core, delivering high AI inference performance for the SoC. With no graphics card required, it can provide a cost-effective industrial solution featuring low power consumption and effective heat transfer.
GPU Performance
Quad Independent Displays with up to 4K Resolution
The WAFER-TGL 3.5" motherboard integrates the latest Intel® Iris® Xe graphics (Gen12), offering max. 96 EUs and up to 2.95 times faster graphics performance to deliver excellent graphics performance. With two HDMI™ 1.4 (up to 4096 x 2160@30Hz), one DP 1.4 (up to 4096 x 2160 @60Hz) and the option to use the iDPM interface to support four independent displays, it is ideal for video surveillance, kiosks, digital signage, or medical imaging application which requires high graphics performance.
Thermal Solution
Well-design Thermal Solution
iEi has developed a highly efficient thermal solution for the 3.5" motherboard - iEi Heat Conduction Casing (IHCC). The IHCC can effectively improve heat transfer performance, and we will keep on improving our heat sink design to ensure providing an innovative thermal solution for the industrial market.
The IHCC consists of a case and a heat conduction block that is made to perfectly fit with the CPU to achieve heat transfer.
Application
Ready for Any Scenario
The WAFER-TGL supports up to quad independent display, thus it is flexible to use in multi-display applications. Its diverse display outputs offered by the iDPM modules make the WAFER-TGL more suitable for any feasible scenario.
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