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PCIE-Q470

全长卡PICMG 1.3 CPU卡支持 LGA1200插槽 Intel® 第10/11代Core™ i9/i7/i5/i3，Pentium®和Celeron® 处理器，基于 Q470芯片组, 支持DDR4内存, HDMI™, 双 Intel® 2.5GbE, USB 3.2, SATA 6Gb/s, M.2, IAUDIO 符合RoHS

PCIE-Q470 Full-size PICMG 1.3 CPU
PCIE-Q470 Full-size PICMG 1.3 CPU
  • PCIE-Q470 Full-size PICMG 1.3 CPU
  • PCIE-Q470 Full-size PICMG 1.3 CPU
1. LGA1200插槽 Intel® 第10/11代 Core™ i9/i7/i5/i3, Celeron® 和 Pentium® 系列处理器
2. 支持双路Intel® i225V 2.5GbE网络控制器芯片
3. 支持USB 3.2 Gen 2 (10Gb/s)Type C接口
4. 支持 M.2 A key 做 WLAN 扩展, M key 做 PCIe NVMe 存储，B key 做5G模块
Maximizes Design Flexibility

Maximizes Design Flexibility

Maximizes
Design Flexibility

The PCIE-Q470 is a full-size PICMG® 1.3 single board computer with scalable CPU options of 10th/11th Intel® Generation Core™ i9/i7/i5/i3, Pentium® and Celeron® processors and Intel® Q470/Q470E chipset, supporting up to 10 cores. With IEI’s comprehensive passive backplane and industrial chassis options, the configurable system can offer increased computing efficiency and flexible I/O expandability through PCIe x16, PCIe x4 and legacy PCI signals, allowing more industrial add-on cards to satisfy the requirements of performance-demanding applications in medical radiology equipment, digital surveillance, transportation and automation applications.

Medical Radiology Equipment

Medical Radiology Equipment

Automation Applications

Automation Applications

Digital Surveillance

Digital Surveillance

Medical Radiology Equipment
Automation Applications
Digital Surveillance

Spec Overview

Performance and Expansion

Connectivity

Solder Side

  • 12V CPU DC input
  • LGA1200 socket for 10th/11th Gen Intel® Core™, Pentium® and Celeron® processors
Performance and Expansion
  • 4 x 288-pin 2933MHz dual-channel DDR4 SDRAM DIMMs support up to 128 GB
  • M.2 3042/3052/2242/2280 B key slot (PCIe Gen3 x2 + USB 2.0)
  • SIM slot
  • Intel® Q470 /Q470E
  • M.2 2230 A key slot (PCIe Gen3 x2 + USB 2.0)
  • 4 x SATA 6Gb/s
    (RAID 0/1/5/10)
  • 2 x USB 3.2 Gen1(5Gb/s)
  • 1 x USB 3.2 Gen1 (5Gb/s) by Type A 180 connector
Connectivity
  • 2 x RS-232
  • Front panel
  • 2 x RS-422/485
  • IAUDIO for AC-KIT-888S audio module
  • DIO
  • 2 x 2.5GbE via Intel® I255V
  • 1 x HDMI™ 1.4b (4096 x 2160 @30Hz)
  • 1 x USB 3.2 Gen2 (10Gb/s)
  • 2 x USB 3.2 Gen1 (5Gb/s)
  • Aluminum stiffener provides protection against PCB bending
  • Solder Side
Solder Side
  • 1 x M.2 2242/2280 M key slot (PCIe Gen3 x4)

Performance

Performance
  • 1
    12V CPU DC input
  • 2
    4 x 288-pin 2933MHz dual-channel DDR4 SDRAM DIMMs support up to 128 GB
  • 3
    LGA1200 socket for 10th/11th Gen Intel® Core™, Pentium® and Celeron® processors
  • 4
    Intel® Q470 /Q470E
  • 5
    M.2 3042/3052/2242/2280 B key slot (PCIe Gen3 x2 + USB 2.0)
  • 6
    SIM slot
  • 7
    M.2 2230 A key slot (PCIe Gen3 x2 + USB 2.0)

Connectivity

Connectivity
  • 1
    4 x SATA 6Gb/s (RAID 0/1/5/10)
  • 2
    2 x RS-232
  • 3
    Front panel
  • 4
    DIO
  • 5
    IAUDIO for AC-KIT-888S audio module
  • 6
    2 x RS-422/485
  • 7
    2 x 2.5GbE via Intel® I255V
  • 8
    1 x HDMI™ 1.4b (4096 x 2160 @30Hz)
  • 9
    1 x USB 3.2 Gen2 (10Gb/s)
  • 10
    2 x USB 3.2 Gen1 (5Gb/s)
  • 11
    2 x USB 3.2 Gen1 (5Gb/s)
  • 12
    1 x USB 3.2 Gen1 (5Gb/s) by Type A 180 connector

Solder Side

Solder Side
  • 1
    1 x M.2 2242/2280 M key slot (PCIe Gen3 x4)
  • 2
    Aluminum stiffener provides protection against PCB bending
  • Aluminum stiffener

Full-size PICMG 1.3

Full-size PICMG 1.3

Standard PICMG 1.3 SBCs have several advantages over non-standard SBCs. Firstly, they are more maintainable than a motherboard system and have a much lower mean time to repair (MTTR). Secondly, it is easy to upgrade to a newer or faster processor if desired.

Features of PICMG 1.3:

  • 20 PCI Express
    20 PCI Express lanes are supported, including PCI Express x16, x8, x4 and x1 configurations

  • ATX power signals are supported
    Provides AUX voltages for standby power and sleep states (soft starts, wake on LAN), supports PSON#, PWRGD, PWRRBT# and ACPI states

Features of PICMG 1.3
Features of PICMG 1.3

Various backplane configuration options are ready by IEI to meet the different needs encountered in embedded computing applications.

Features of PICMG 1.3
Features of PICMG 1.3

Performance Boost

The 10th and 11th Gen Intel® Core™ processors, ranging from 6 to 10 cores, with increased I/O capacity and the latest DDR4-2933 memory support deliver the performance required to consolidate multiple industrial workloads. The CPU benchmark boosts up to 85% better integer multi-tasking compute intensive application performance on 11th Gen Intel® Core™ i5 processor.

CPU Benchmarks

Embedded CPU Support List for 10th Gen Intel® Processors

Sockets Brand Process Cores/Threads CPU Processor Base Frequency Cache TDP Processor Graphics Graphics Base Frequency Memory Types Chipset
FCLGA1200 CoreTM i9 14nm Comet Lake-S 10/20 I9-10900E 2.8 GHz 20MB 65W Intel® UHD Graphics 630 350 MHz DDR4-2933 Q470/Q470E
10/20 I9-10900TE 1.8 GHz 20MB 35W DDR4-2933
CoreTM i7 8/16 I7-10700E 2.9 GHz 16MB 65W DDR4-2933
8/16 I7-10700TE 2.0 GHz 16MB 35W DDR4-2933
CoreTM i5 6/12 I5-10500E 3.1 GHz 8MB 65W DDR4-2666
CoreTM i5 6/12 I5-10500TE 2.3 GHz 8MB 35W DDR4-2666
CoreTM i3 4/8 I3-10100E 3.2 GHz 9MB 65W DDR4-2666
CoreTM i3 4/8 I3-10100TE 2.3 GHz 9MB 35W DDR4-2666
Pentium® 2/4 G6400E 3.8 GHz 4MB 58W DDR4-2400
Pentium® 2/4 G6400TE 3.2 GHz 4MB 35W DDR4-2400
Celeron® 2/2 G5900E 3.2 GHz 2MB 58W DDR4-2400
Celeron® 2/2 G5900TE 3.0 GHz 2MB 35W DDR4-2400

Performance Boost DDR4 Dual-channel

Built with four DIMMs dual-channel mode, allowing significant performance boost on the system.

4 DIMMs up to 128G

Performance Boost DDR4 Dual-channel

Data Protection

Data Protection

RAID 0/1/5/10 Protection

The PCIE-Q470 offers four high speed SATA 6Gb/s interfaces with configurable RAID 0, 1, 5, 10 functionality that can expand storage capabilities and enable fast data transfers.

RAID 0/1/5/10 Protection

  • RAID 0 (Striping) -The highest performing level

  • RAID 1 (Mirroring) -Data safety

  • RAID 5 (Distributed Parity)-offers both data safety and performance

  • RAID 10 (combining mirroring and striping) data safety and big data volume

Disk
Disk
Disk
Disk
Features RAID 0 RAID 1 RAID 5 RAID 10
Minimum # Drives 2 2 3 4
Data Protection No Single-drive failure Single-drive failure Up to one disk failure in each sub-array
Capacity Utilization 100% 50% 67%-94% 50%
Typical Application High end workstations, data logging, real-time rendering, very transitory data Operating system, Transaction database Data warehousing, web serving, archiving Fast databases, application servers

Internal USB Encryption Lock

Internal USB Encryption Lock

The internal 180° USB port allows users to plug-in a USB encryption lock directly onto the motherboard so the device is hidden away and safely contained within the case of the system. With data encrypted, you don't need to worry about leaking private data any more.

USB

Intel® PTT Security

setup

Intel® Platform Trust Technology (Intel® PTT) offers the capabilities of discrete TPM 2.0.
TPM can be leveraged to encrypt your storage drive. This protects your data, including your identity and operating system files and also protects your data in the case of physical theft.

High Speed Transmission

High Speed Transmission

Delivers Dual Low-Latency 2.5G LAN by Intel

The on-board dual Intel® I225V 2.5GbE controllers enable the PCIE-Q470 to meet the bandwidth-intensive requirements such as large file transfers and high-resolution video streaming.

Redundant Networking Connection

With dual LAN configuration, the network redundancy for an internet connection has backup connectivity to switch the network from the first LAN input to the other LAN input automatically to avoid and mitigate the risk of downtime.

Redundant Networking Connection

Multiple Device Connection

With dual LAN configuration, the single-board computer is capable of connecting various devices such as sensors, multiple cameras, or other hardware that connects to an industrial SBC.

Multiple Device Connection-1
Multiple Device Connection-2
Multiple Device Connection-3

10 Gb/s USB 3.2 Gen 2 Type-C Foolproof Connector

10 Gb/s USB 3.2 Gen 2 Type-C Foolproof Connector

USB Type-C connectors are widely adopted by many electronic devices, such as portable SSD hard drives, smart phones, USB cameras, etc. The PCIE-Q470 uses the reversible connector that should end the bane of users fiddling at the back of computers.

10 Gb/s USB 3.2 Gen 2 Type-C Foolproof Connector

M.2 2242/2280 M Key for NVMe SSD or AI Accelerator

interface

The M.2 2242/80 M-key socket with PCI Express® 3.0 x4 bandwidth supports up to 32Gbps data-transfer speeds. The sequential read/write speed is 5 times than SATA 6Gb/s. It's the perfect choice for installing an operating system or application drive to provide fast data access.

interface

The M.2 2242/80 M-key socket with PCI Express® 3.0 x4 bandwidth supports up to 32Gbps data-transfer speeds. The sequential read/write speed is 5 times than SATA 6Gb/s. It's the perfect choice for installing an operating system or application drive to provide fast data access.

AI Accelerator

The Mustang-M2BM-MX2 card equipped with two Intel® Movidius™ Myriad™ X VPU, providing an flexible AI inference computing.

Learn More
AI Accelerator
NVMe
NVMe

Networking

M.2 B Key with SIM Slot for LTE Cellular Communication

The M.2 B key supporting PCI Express 3.0 x2 signals plus onboard SIM slot allows you to use a LTE radio frequency to ensure secure and delay-free data transmission in smart manufacturing.

Networking

M.2 2230 A Key for Wi-Fi/Bluetooth

The M.2 2230 A key slot carrying with PCIe 3.0 x2 and USB 2.0 signals allows it to adopt the latest Wi-Fi 6E technology. Wi-Fi 6E enhances low latency and supports service levels that are equivalent to 5G networks.

Networking

Instant System-level Solution

Instant System-level Solution

To suit different AIoT applications, IEI offers a comprehensive range of PICMG 1.3 passive backplanes and industrial chassis to give system designers expanded options for integrating multi-level processors within a variety of configurations.

PAC series wall-mount chassis

4U/5U rack-mount chassis

1U/2U rack-mount chassis

PICMG 1.3 (PCIe+PCI) Model PE-2SD1 PE-3S1 PE-4S PE-5S PE-5S2 PE-6S PE-6S2 PE-6SD PE-6SD3
Total Slot 2 5 4 5 5 6 6 5 5
Expansion Slots PCIe Slots x16* 1 (Gen 2.0) 1 (Gen 3.0) 1 1 (Gen 2.0) 1 (Gen 2.0) 1 (Gen 2.0) 1 (Gen 2.0) 1 (Gen 2.0) 1 (Gen 2.0)
X4 1 (Gen 3.0) 1 1 ( Gen 2.0) 1 ( Gen 2.0) 1 ( Gen 2.0)
X1 3 (Gen 2.0) 2 (Gen 2.0) 3 (Gen 2.0)
PCI-X Slots
PCI Slots 1 2 2 3 2
USB Connectors by Pin Header 4 4 4 4 4 4 4 4
PSU Type 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX
Chassis RACK-1150-PE RACK-500AI N/A N/A N/A RACK-305G
RACK-360G
RACK-3000G
PAC-1700G
PAC-125 G
 PAC-106G
PAC-1000G 		N/A N/A
Note 1U Type 2U Type 2U Type
PICMG 1.3 (PCIe+PCI) Model PE-7S PE-8S PE-9S PE-10S PE-10S2 PXE-13S
Total Slot 7 8 9 10 10 13
Expansion Slots PCIe Slots x16* 1 (Gen 2.0) 1 (Gen 3.0) 1 1 (Gen 2.0) 1 (Gen 2.0) 1 (Gen 3.0)
X4
X1 2 (Gen 2.0) 3 (Gen 2.0) 4 (Gen 2.0) 4 (Gen 2.0) 4 (Gen 2.0) 3 (Gen 3.0)
PCI-X Slots
PCI Slots 3 3 3 4 4 8
USB Connectors by Pin Header 4 4 4 4 4 4
PSU Type 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX 24+4-pin ATX
Chassis PAC-1700G PAC-125G N/A RACK-305G
RACK-360G
RACK-3000G 		RACK-3000G
RACK-305G
RACK-360G 		RACK-3000G
RACK-305G
RACK-360G
Note PCIe to PCI Bridge Backplane
*When using a PCIe x16 add-on card, the length of the card must not exceed 167mm or 6.57 inches.

Automated Inspection Machine Application

Automated Inspection Machine Application
Automated Inspection Machine Application RACK-3000G GPOE-4P GPOE-4P

Specifications

Hardware Spec.

尺寸类型
尺寸类型 长卡单板电脑
系统
CPU LGA1200插槽 Intel® 第10/11代 Core™ i9/i7/i5/i3, Celeron® 和 Pentium® 系列处理器 (CPU支持到65W)
芯片组 Intel® Q470/Q470E
内存 4 x 288-pin 2933 MHz 双通道 DDR4 DIMMs ，支持多达至128G
内存上限 支持多达至128G
散热方案/系统风扇 1 x CPU风扇接口 (1x4 pin)
1 x 系统风扇接口 (1x4 pin)
物理特性
尺寸 (LxWxH) (mm) 338 mm x 126 mm
净重 500g
存储
存储 4 x SATA : 6Gb/s (支持 RAID 0/1/5/10)
1 x M.2(NGFF) : M Key (2280/2242) (with PCIe Gen3 x4), 支持 NVME 存储
I/O 接口
显示输出 1 x HDMI™ : 高达4096 x 2160@30Hz
网络 2 x LAN :
LAN1: Intel® I225V 2.5GbE 控制器
LAN2: Intel® I225V 2.5GbE 控制器
音频 1 x HD Audio : 1 x IAUDIO，支持IEI AC-KIT-888S音频组件 (2x5 pin)
I/O接口 2 x 内部RS-232 : 2x5 pin, P=2.0
2 x Internal RS-422/485 : 1x4 pin, P=2.00 ,RS-485 支持 AFC
2 x 外部 USB 3.2 Gen1x1 : 5Gb/s (Type-A)
6 x 内部 USB 2.0 : 2x4 pin, P=2.54
3 x 内部 USB 3.2 Gen1x1 :
2 x USB 3.2 Gen1 (5Gb/s) (2x10 pin，P=2.00)
1 x USB 3.2 Gen1 (Type A 180°)
DIO : 12位数字 I/O (2x7 pin)
1 x 外部 USB 3.2 Gen2x1 : 10Gb/s (Type-C)
扩展 1 x PCIe x16 :
信号来自CPU通过金手指
(支持 x16, 或 x8 + x8, 或 x4 + x4 + x8)
1 x PCIe x4 :
信号来自PCH通过金手指
(支持一个 x4, 或四个 x1)
4 x PCI Slot : 信号通过金手指
3 x M.2(NGFF) :
1 x M.2 A Key (2230) (基于PCIe Gen3 x2/USB 2.0信号)
1 x M.2 B Key (3042/3052/2280) w/ SIM holder (基于 PCIe Gen3 x2信号)
1 x M.2 M Key (2280/2242) (基于PCIe Gen3 x4信号)
电源
电源供电 ATX/AT 供电
支持 AT/ATX 模式
符合ErP/EuP
环境
操作温度 0°C – 60°C
存储温度 -30°C – 70°C
Humidity 5% ~ 95%, 无冷凝
认证
Safety & EMC 符合CE/FCC

Ordering Information

PCIE-Q470-R10 Full-size PICMG 1.3 CPU Card supports LGA1200 Intel® 10th/11th Gen. Core™ i9/i7/i5/i3/Pentium®/Celeron® CPU with Q470E, DDR4, HDMI™, Dual Intel® 2.5GbE, USB 3.2, SATA 6Gb/s, M.2,HD Audio and RoHS

Package Contents

Package Content

  • 1 x PCIE-Q470 单板电脑

  • 2 x SATA 线材

  • 1 x I/O 挡片

  • 1 x QIG

Download Specs.

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