DRPC-240-TGL TSN/TCC Developer Kit

Optimizing AI Inference, Easy AI Deployment, Hard Real-Time Computing

IEI DRPC TSN/TCC Developer Kit is a compact yet powerful industrial grade embedded system that lets you easily optimize and deploy AI inference at the rugged edge. It is ready-to-use, simple to get started, and is equipped with what you need—11th Gen Intel® Core™ i5 processor, 8GB DDR4 memory, 256GB SSD, and Yocto Project® OS image—to deploy your AI solutions quickly and easily. Moreover, this developer kit makes real-time computing a basic feature in simplifying time-sensitive application design for device manufacturers.


High AI Inference Capability

The 11th Gen Intel® Core™ i5 processor comes with Intel® Iris® Xe graphics, of up to 96 graphics EUs, and boosts high AI performance at 4.15 TFLOPS and 8.29 TOPS.

Built for Ruggedness

The ruggedness and durable design of the developer kit has been tested by IEI’s experienced engineers under harsh environments as defined by the MIL-STD standard, in our qualified laboratory.

Scalability with Modular
Expansion Design

The modular PCIe x4 expansion capability allows add-ons of interface cards. The four 2.5GbE ports are capable of delivering PoE power with optional power modules.

Integrated Yocto Image

IEI helps ease this burden on OS development and provides a reliable embedded Yocto Project® OS image.

Hard Real-Time Compute

The DRPC TSN/TCC Developer Kit supports both Intel® Time Coordinated Computing (Intel® TCC) and Time Sensitive Networking (TSN) for Time-Critical Performance. These technologies assure accurate and stable delay time for critical real-time data across the network.

Hardware Features

Powered by 11th Gen Intel® Processor

The DRPC TSN/TCC Developer Kit is powered by the 11th Gen Intel® Core™ i5 processor for a balance of performance and responsiveness in a low-power platform. The 11th Gen Intel® Core™ processor is up to 23% faster in single-thread performance and up to 19% faster in multi-thread performance than its prior generation for smoother handling of intensive computing tasks.
The processor is optimized for real-time featuring Intel® Time Coordinated Computing (Intel® TCC) and can also be paired with Intel Ethernet controller i225/i226 Series with TSN.
With the new Intel® Iris® Xe graphics architecture, the GPU is integrated with 80EUs and gains 2.95x the graphics performance over the 8th generation Intel® Core™ processors.

Versatile, Space-Saving Design for Flexible Installation

IEI DRPC TSN/TCC Developer Kit measures just 190 x 150 x 80mm, so it takes up very little room to help you maintain a clutter-free workspace. Its DIN-rail mounting support enables the system to be used across space-critical industries and workplace environments. With a compact size and rubber foot pads provided, the DRPC TSN/TCC Developer Kit is also perfect for set-top box use.

Industrial-Grade Hardened Hardware Design with 12V~28V DC Wide-Range Power Input

Ruggedized hardware architecture safeguards the small form factor developer kit in harsh, remote and dynamic environments.

» Fanless cooling eliminates failure points

» -20°C to 60°C wide operating temperature

» 50G shock and 3 Grms vibration tolerance

» Wide 12V to 28V DC voltage input

» Intel® Platform Trust Technology (Intel® PTT) to enable password protection, device authentication and future-ready cybersecurity



Fanless System with Reliable Thermal Design

The DRPC TSN/TCC Developer Kit's thermal design is optimized for better heat conduction using a pin-fin heatsink concept. This enhances two dimensional heat conduction and reduces flow impedance for better heat dissipation in this fan-less system. The overall weight is thus reduced by 35%, significantly enhancing system reliability in vibration-sensitive applications, such as AGV (Automated Guided Vehicle). Moreover, this innovative thermal design allows the DRPC TSN/TCC Developer Kit to maximize superior performance compared with others that use traditional plate heatsink consisting of parallel fins.

Lightweight & Thin Cooling Solution

Stackable, Modular PCIe x4 Design for Added Functionality

Adding an optional second stack expansion kit, TXC-DRPC TSN/TCC Developer Kit-1S-R10, enables the DRPC TSN/TCC Developer Kit to have flexible functionality for installing a variety of PCIe x4 add-on cards, such as high density I/O cards, vision cards, motion cards and AI accelerators, according to specific application requiremetns via simple and reliable board-to-board conections.

Quad Port 2.5 Gigabit Ethernet with PoE Power

The DRPC TSN/TCC Developer Kit has four 2.5GbE RJ-45 ports to meet the requirements of bandwidth-demanding applications. In addition, the DRPC TSN/TCC Developer Kit is compliant with the IEEE 802.3af PoE standard and offers 4-port 15.4-watt PoE capabilities with the optional PoE power module (GPOE DRPC TSN/TCC Developer Kit), which transforms all of the four 2.5GbE ports to be PoE capable.

The DRPC TSN/TCC Developer Kit can supply a total power budget of 60 watts to meet the demands of many power devices (PDs) (such as IP cameras, wireless APs, IP phones and LED lights).

Wireless Connectivity and AI Accelerating for Edge Telemetry

The DRPC TSN/TCC Developer Kit enables seamless wireless connectivity and AI acceleration for remote and mobile edge deployments.
» 4G/LTE with the M.2 3042 B key slot with SIM socket on board (USB 3.2 Gen 1/USB 2.0 mode) or AI accelerator by M.2 3080 B key slot (PCIe x2 mode)
» Wi-Fi & Bluetooth by M.2 2230 A key slot (PCIe x1 and USB 2.0 mode)

Ready-to-Run, Hard Real-Time Computing with Intel® TCC and TSN Support

Hard real-time is necessary in areas such as robotics, automotive, and utilities where a capability fails if it cannot be executed within the allotted time span. To achieve the stringent real-time computing requirements, the DRPC TSN/TCC Developer Kit supports both Intel® Time Coordinated Computing (Intel® TCC) and Time-Sensitive Networking (TSN) to assure accurate and stable delay time for critical real-time data across the network.

TSN and Intel® TCC are two complementary technologies for real-time communication over IP. TSN defines a set of standards for how time sensitive data is transmitted over Ethernet networks. Intel® TCC reduces jitter and improves performance for latency sensitive applications.

* Hardware and Software for Real-Time Computing

Time Synchronization Optimization by TGPIO

To have a precise time synchronization between devices, the RS-232 port on DRPC-240 developer kit has Time-Aware GPIO (TGPIO) allowing you to control devices using timestamps.

Time-Aware GPIO (TGPIO) Samples

Hardware Overview

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Extend the Functionality of Your Developer Kit

With flexibility and convenience – various options await! Build your iconic DRPC TSN/TCC Developer Kit by choosing functional expasions!


We will empower you every step of the way


Ordering Information

AI Accelerator Card Options

Packing List